FPC/PCB Process Capability

We are a trusted partner for your FPC and PCB RIDIG-FLEX products. No matter what process you need for your FPC or PCB, we can provide professional service

FPC is a flexible printed circuit board, which can be divided into two types: FPC with glue and FPC without glue.

Because there is an adhesive between FPC copper foil and substrate, so its flexibility, copper foil and substrate adhesion are poor, so there is a glue FPC basic has been eliminated.
According to the number of layers of conductive copper foil, it can be divided into single layer FPC, double layer FPC, multi-layer FPC, etc., even for high resolution products, because the line is not complicated, the use of double layer structure is enough to cope with.

PCB is printed circuit board.

PCB is composed of copper foil substrate (copper-clad Laminate, CCL for short) and substrate, similar to FPC is also divided into single-layer PCB, double-layer PCB, multi-layer PCB, etc. The substrate is divided into Paper Phenolic Resin substrate, half glass fiber, all glass fiber board, etc.

Mass production of FPC and PCB products

FPC production

FPC products are widely used in the electronics industry, with the characteristics of light weight and bendability

RIDIG-FLEX production

Rigid-Flex is a board that connects FPC and PCB, and has both characteristics, which can provide stability and reduce size

COF production

COF is a technology that encapsulates IC into FPC, which is beneficial to provide thin and light products

PCB-HDI production

Printed circuit boards are important electronic components and are widely used in highly integrated products

FPC critical Process

1.Surface Treatment of FPC Substrate

First of all, the surface treatment of the FPC substrate is carried out. The purpose of this step is to remove the dirt and rust on the surface of the copper foil to facilitate subsequent processing.

2.Laser drilling or drilling

The holes on the display FPC are divided into via holes, through holes and holes for fixing. These three kinds of holes are processed on the FPC substrate by laser drilling or mechanical drilling.

3.Guide hole blackening

Holes have been formed on the FPC substrate, and the purpose of the via holes is to connect the upper and lower copper foils. However, due to the isolation of the PI layer, electroplating cannot be performed, so chemicals are needed to connect the upper and lower copper foils.

4.Copper plated via hole

Copper is plated inside the via hole by means of electroplating, and the copper foil on both sides is conducted.

5.Attach photosensitive film

A photosensitive film is pasted on the copper foil on both sides, and the photosensitive film will decompose under the condition of light and dissolve in a specific solvent. Use this method to realize the production of the circuit,

6.Photosensitive film exposure

Cover the photosensitive film according to the set circuit, and then expose to ultraviolet light, the photosensitive film will remain in the covered position, and the photosensitive film in the rest will decompose.

7.etched copper foil

The position without the protection of the photosensitive film will be etched away, and the rest is the circuit we need.

8.Remove photosensitive film

After etching, we no longer need the photosensitive film, and use a special solvent to remove the remaining photosensitive film.

9.Attach protective film

Lay the protective film completely on the etched copper surface as a protective film and insulating layer on the line.

10.Printing Photosensitive Ink

Use the printing method to bond the photosensitive ink to the copper surface, and cooperate with the exposure to produce a chemical reaction to complete the protection of the copper foil and indicate the placement of the parts.

11.Photosensitive ink exposure

Use exposure to leave the area that needs ink. The photosensitive ink has the same function as the photosensitive film, and the part that violates the cover will be decomposed by UV light.

12.heat curing ink

The ink will be completely cured after heating, and the green ink can be seen on the display FPC. These inks are completed in this way

13.gold plated

Oxidation resistance, wear resistance and electrical conductivity of the contact surface are increased by gold plating.

14.Print Logo and Content

Print logos and content, such as trademarks and models, by silk screen printing.

15.Add reinforcement board

Add resin reinforcement boards or steel sheet reinforcement boards where FPC needs to be, such as component areas, connector areas, or areas subject to greater stress, to increase durability and strength.

Our FPC Process Capabilities

unit（μm ）			2020			2021	2022
FPC layer			regular	limit		8F	10F
			4F	6L
PI thickness(FCCL)			12-50um	12-50um		12-50um	7-50um
Mechanical drilling size			100μm/350um	100/300um		100μm/300um	100μm/300um
Laser drill size			75μm/250um	50/200um		40μm/180um	30μm/150um
Line width and line spacing	Copper foil thickness= 9		45/45	35/35		30/30	25/25
	Copper foil thickness=12		50/50	40/40		35/35	30/30
	Copper foil thickness=18		60/60	55/55		50/50	45/45
Impedance control			±10%	±8%		±8%	±7%
Forming tolerance			Min ±50μm	Min ±50μm		Min ±50μm	Min ±50μm
PI film		Size of the opening	500μm	400μm		400μm	300μm
		Alignment tolerance	±150μm	±100μm		±75μm	±75μm
photosensitive ink		Size of the opening	250μm	200um		150μm	150μm
		Alignment tolerance	50μm/30um	50um/20um		50μm/15um	40μm/15um
thermoset ink		Alignment tolerance	300um	200um		200um	150um
Reinforcing sheet fit		Alignment tolerance	150um	100um		100um	80um
surface treatment			ENIG/ENEPIG/OSP
cover film			PI 12um		PI 7.5um	PI 7.5um	PI 5um

Our Rigid-Flex Process Capabilities

Unit（μm）		2020		2021	2022
material	PI thickness	regular	limit	12-50um	7-50um
	PI thickness	12-50um	12-50um	12-50um	7-50um
	low flow glue PP	Normal TG、High TG	Normal TG、High TG	Normal TG、High TG	Normal TG、High TG、 Low loss
RF layers	Layer Count	4L	6-8L	4-10L	4-14L
RF layers	HDI	Plus 1	Plus 2	Anylayer	Anylayer
Total thickness	thickness	0.25-1.6mm	0.25-1.6mm	0.25-2.0mm	0.25-2.0mm
Copper thickness	Inner & Outer	1/3-2OZ	1/3-2OZ	1/4-2OZ	1/4-2OZ
surface treatment	Processing method	ENIG、Gold Plating、OSP、Soft ENIG、ENEPIG
Line width/line spacing	inner	50/50μm(RF); 45/45μm (Flex)	40/40μm(RF); 35/35μm (Flex)	35/35μm(RF); 30/30μm(Flex)	30/30μm(RF); 25/25μm(Flex)
Line width/line spacing	outer	55/55μm(RF)	50/50μm(RF)	45/45μm(RF)	40/40μm(RF)
Aperture	Mechanical drilling	150μm/400um	150μm/350um	100μm/300μm	100μm/300μm
Aperture	laser drilling	100μm/300um	75μm/250um	50μm/200um	35μm/150um
impedance	Impedance specification	10%	10%	10%	7%
PSR	Alignment tolerance	50um/30um	50um/20um	50um/20um	40um/20um
Steel sheet	Process tolerance	150um	100um	100um	80um
W/B area	Flatness	25um/50um	20um/40um	20um/30um	15um/25um
shape	tolerance	150um	100um	100um	75um

Our SMT Process Capabilities

item	2020		2021	2022
Part packaging	regular	limit	01005	03015
Part packaging	0201	01005	01005	03015
BGA/ QFN …	0.4mm Pitch	0.3mmPitch	0.3mm Pitch	0.3mm Pitch
connector	0.35mm Pitch	0.3mmPitch	0.3mm Pitch	0.25mm Pitch
Solder Paste Thickness Tolerance	0.05 mm	0.04mm	0.03 mm	0.03 mm

Our critical equipment

mass-produced products

Item	Description
layer	2L FPC
thickness	0.3±0.05
dimension	3.4*255.7mm
surface treatment	EING
Solder mask	White
Through hole size	100um
Line width/spacing (Min.)	50/50um
copper plated	Copper plating
production	Light Bar

Item	Description
layer	2L FPC
thickness	0.3mm±0.03mm
dimension	30.6*26.4mm
surface treatment	ENEPIG
Solder mask	Green/Yellow
Through hole size	100um
Laser Via	70um
Line width/spacing (Min.)	40/40um
copper plated	Copper plating
impedance	100 ohm±10%
production	Fingerprint